Advanced Packaging & Surface Mount Technology (USM APSMT) research group hosted a meeting between our group members and Malaysian Institute of Marine Engineering Technology (UniKL MIMET) representatives on 19 February 2020 at the School of Mechanical Engineering, USM. As a result of the meeting, USM APSMT, in collaboration with UniKL MIMET, will organise an "International Conference on Mechanical, Electrical/Electronic Engineering & Technology (IMEET)"  on 2-3 November 2020. The inaugural IMEET conference will be held in Genting Highland, Malaysia, and the place will be finalized later. The details of the conference can be found in imeet2020.eng.usm.my . We welcome the participation of researchers/lecturers/students from mechanical, electrical, electronics and related areas. See you in Genting Highland in November.

Secretariat and invited speakers of EPRS 2018

14 March 2018 – The Electronics Packaging Research Society (EPRS) symposium conducted at Seminar Room, School of Aerospace Engineering, Engineering Campus, Universiti Sains Malaysia. The event is an annual event that provides a platform for dissemination knowledge on advanced semiconductor packaging in Malaysia since 2005 at the national level. 

Fluid Structure Interaction (FSI) short course conducted between 25 and 27 September 2017 at School of Aerospace Engineering, Universiti Sains Malaysia.