Postponement of IMEET 2020

imeet 2020 POSTPONED

Dear All,

Based on IMEET committee meeting on 9 June 2020, we are really sorry to inform all potential participants and fellow researchers that the IMEET 2020 conference is postponed to another date in 2021 (possibly around July/August next year) due to COVID-19 pandemic. We hope all of you are in good condition while staying at home. 

We wish to see you next year in IMEET 2021 and please keep in touch with us for the latest announcements and updates on IMEET 2021.

Best Regards,

IMEET Committee

 

IMEET 2020 Meeting with UniKL MIMET

Advanced Packaging & Surface Mount Technology (USM APSMT) research group hosted a meeting between our group members and Malaysian Institute of Marine Engineering Technology (UniKL MIMET) representatives on 19 February 2020 at the School of Mechanical Engineering, USM. As a result of the meeting, USM APSMT, in collaboration with UniKL MIMET, will organise an "International Conference on Mechanical, Electrical/Electronic Engineering & Technology (IMEET)"  on 2-3 November 2020. The inaugural IMEET conference will be held in Genting Highland, Malaysia, and the place will be finalized later. The details of the conference can be found in imeet2020.eng.usm.my . We welcome the participation of researchers/lecturers/students from mechanical, electrical, electronics and related areas. See you in Genting Highland in November.

Continue Reading

ELECTRONICS PACKAGING RESEARCH SOCIETY (EPRS) SYMPOSIUM 2018

EPRS AWAL RAMAI2

Secretariat and invited speakers of EPRS 2018

14 March 2018 – The Electronics Packaging Research Society (EPRS) symposium conducted at Seminar Room, School of Aerospace Engineering, Engineering Campus, Universiti Sains Malaysia. The event is an annual event that provides a platform for dissemination knowledge on advanced semiconductor packaging in Malaysia since 2005 at the national level. 

Continue Reading