Introduction

Welcome to Advanced Packaging & Surface Mount Technology Research Group

The Advanced Packaging & Surface Mount Technology (APSMT) research group was officially established in 2014 at School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia. The APSMT research group focuses on research and training programs in the areas of electronic packaging, electronic cooling, electronic materials, microsystem modelling, stretchable electronics, reliability assessment, modelling and simulation, which offering solutions to advanced packaging technologies.