Publication
Selected International Journals (From 2010 - Now)
| No. | Authors | Title | Year | Source title |
| 1 | Hamid, M.F., Abdullah, M.K., Idroas, M.Y., Zainal Alauddin, Z.A., Sharzali, C.M., Naser, M.A.M., Khimi, S.R. | A study of performance of a diesel engine fueled with emulsified biofuel and its blends | 2018 | Journal of Physics: Conference Series |
| 2 | Chuin, L.H., Omar, A.F., Abdullah, M.Z., Razak, N.A. | Characterization and Evaluation of PIV Illumination System Using High Power Light Emitting Diodes for WaterTank Applications | 2018 | Instruments and Experimental Techniques |
| 3 | Janvekar, A.A., Abdullah, M.Z., Ahmad, Z.A., Abas, A., Bashir, M., Mohamed, M. | Comparative study on porous media combustion characteristics using different discrete materials | 2018 | MATEC Web of Conferences |
| 4 | Mukhtar, M.A.F.M., Abas, A., Haslinda, M.S., Ani, F.C., Abdullah, M.Z., Jalar, A., Ismail, R. | Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0Ag-0.5Cu (SAC305) | 2018 | IOP Conference Series: Materials Science and Engineering |
| 5 | Ismail, M.A., Wang, J. | Effect of nozzle rotation angles and sizes on thermal characteristic of swirl anti-icing | 2018 | Journal of Mechanical Science and Technology |
| 6 | Abas, A., Ng, F.C., Gan, Z.L., Ishak, M.H.H., Abdullah, M.Z., Chong, G.Y. | Effect of scale size, orientation type and dispensing method on void formation in the CUF encapsulation of BGA | 2018 | Sadhana - Academy Proceedings in Engineering Sciences |
| 7 | Ng, F.C., Abas, A., Abdullah, M.Z. | Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches | 2018 | Microelectronics Reliability |
| 8 | Ng, F.C., Abas, A., Abustan, I., Rozainy, Z.M.R., Abdullah, M.Z., Jamaludin, A.B., Kon, S.M. | Effect of the gap height of radial gate on the volumetric flow rate in dam | 2018 | IOP Conference Series: Materials Science and Engineering |
| 9 | Teoh, Y.H., Masjuki, H.H., How, H.G., Kalam, M.A., Yu, K.H., Alabdulkarem, A. | Effect of two-stage injection dwell angle on engine combustion and performance characteristics of a common-rail diesel engine fueled with coconut oil methyl esters-diesel fuel blends | 2018 | Fuel |
| 10 | Teoh, H.-C., Yaacob, K.A., Saad, A.A., Mariatti, M. | Enhancement of thermal and electrical conductivities of cyanoacrylate by addition of carbon based nanofillers | 2018 | Journal of Materials Science: Materials in Electronics |
| 11 | Janvekar, A.A., Abdullah, M.Z., Ahmad, Z.A., Abas, A., Ismail, A.K., Hussien, A.A., Kataraki, P.S., Ishak, M.H.H., Mazlan, M., Zubair, A.F. | Experiential study on temperature and emission performance of micro burner during porous media combustion | 2018 | IOP Conference Series: Materials Science and Engineering |
| 12 | Janvekar, A.A., Abdullah, M.Z., Ahmad, Z.A., Abas, A., Zuber, M., Ismail, A.K., Hussien, A., Kataraki, P., Mohamed, M., Bashir, M., Husin, A., Fadzli, K. | Experimental and numerical studies of porous media combustion in micro burner | 2018 | Journal of Advanced Research in Fluid Mechanics and Thermal Sciences |
| 13 | Nasir, F.M., Abdullah, M.Z., Ismail, M.A. | Experimental investigation on the heat transfer performance of heat pipes in cooling hev lithium-ion batteries | 2018 | Heat Transfer Research |
| 14 | Azam, Q., Ismail, M.A., Mazlan, N.M. | Experimental study of bias acoustic liner on nacelle lip-skin | 2018 | Journal of Mechanical Engineering |
| 15 | Azmi, M.A., Abdullah, M.K., Abdullah, M.Z., Ariff, Z.M., Ismail, M.A., Abdul Aziz, M.S. | Flow Behavior Analysis of Emc in Molded Underfill (Muf) Encapsulation for Multi Flip-Chip Package | 2018 | Journal of Physics: Conference Series |
| 16 | Ng, F.C., Abas, A., Abustan, I., Rozainy, Z.M.R., Abdullah, M.Z., Jamaludin, A.B., Kon, S.M. | Fluid/structure interaction study on the variation of radial gate's gap height in dam | 2018 | IOP Conference Series: Materials Science and Engineering |
| 17 | Gunnasegaran, P., Abdullah, M.Z., Yusoff, M.Z., Kanna, R. | Heat Transfer in a Loop Heat Pipe using Diamond-H<inf>2</inf>O Nanofluid | 2018 | Heat Transfer Engineering |
| 18 | How, H.G., Teoh, Y.H., Yu, K.H., Chuah, H.G., Lim, K.W.S. | Impact of gasoline RON on engine vibration, knock and sound level in a single-cylinder SI engine | 2018 | Journal of Advanced Research in Fluid Mechanics and Thermal Sciences |
| 19 | Teoh, Y.H., How, H.G., Yu, K.H., Chuah, H.G., Yin, W.L. | Influence of octane number rating on performance, emission and combustion characteristics in spark ignition engine | 2018 | Journal of Advanced Research in Fluid Mechanics and Thermal Sciences |
| 20 | Janvekar, A.A., Abdullah, M.Z., Ahmad, Z.A., Abas, A., Hussien, A.A., Kataraki, P.S., Mohamed, M., Husin, A., Fadzli, K. | Investigation of micro burner performance during porous media combustion for surface and submerged flames | 2018 | IOP Conference Series: Materials Science and Engineering |
| 21 | Chellvarajoo, S., Abdullah, M.Z. | Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality | 2018 | Microelectronics Reliability |
| 22 | Rusdi, M.S., Abdullah, M.Z., Aziz, M.S.A., Abdullah-Harun, M.K., Chellvarajoo, S., Husin, A., Rethinasamy, P., Veerasamy, S. | Multiphase flow in solder paste stencil printing process using CFD approach | 2018 | Journal of Advanced Research in Fluid Mechanics and Thermal Sciences |
| 23 | Hamid, M.F., Idroas, M.Y., Sa'ad, S., Saiful Bahri, A.J., Sharzali, C.M., Abdullah, M.K., Zainal, Z.A. | Numerical investigation of in-cylinder air flow characteristic improvement for Emulsified biofuel (EB) application | 2018 | Renewable Energy |
| 24 | Rusdi, M.S., Abdullah, M.Z., Aziz, M.S.A., Abdullah, M.K., Bakar, A.A., Samad, M.H.S.A., Rethinasamy, P., Veerasamy, S., Khor, C.Y. | Numerical Investigation on the Effect of Squeegee Angle during Stencil Printing Process | 2018 | Journal of Physics: Conference Series |
| 25 | Yu, K.H., Teoh, Y.H., Ismail, M.A., Lee, C.F., Ismail, F. | Numerical investigation on the influence of gas area fraction on developing flow in a pipe containing superhydrophobic transverse grooves | 2018 | Journal of Advanced Research in Fluid Mechanics and Thermal Sciences |
| 26 | Nasir, F.M., Abdullah, M.Z., Ismail, M.A. | Optimization of operating conditions of heat pipes BTMS using response surface method | 2018 | AIP Conference Proceedings |
| 27 | Abu Bakar, H., Abas, A., Mokhtar, N.H., Razak, N., Hamid, M.N.B.A. | Particle image velocimetry and finite volume method study of bi-leaflet artificial heart valve | 2018 | Journal of Applied Fluid Mechanics |
| 28 | Ani, F.C., Jalar, A., Saad, A.A., Khor, C.Y., Ismail, R., Bachok, Z., Abas, M.A., Othman, N.K. | SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly | 2018 | Soldering and Surface Mount Technology |
| 29 | Hafizah Mokhtar, N., Abas, A. | Simulation of Blood flow in Artificial Heart Valve Design through Left heart | 2018 | IOP Conference Series: Materials Science and Engineering |
| 30 | Hafizah Mokhtar, N., Abas, A. | Simulation of Blood flow in Different Configurations Design of Bi-leaflet Mechanical Heart Valve | 2018 | IOP Conference Series: Materials Science and Engineering |
| 31 | Syed, M.H.Y., Ismail, M.A., Azam, Q., Rajendran, P., Mazlan, N.M. | Simulation Study of the Effect of Anti-Icing on the Nacelle Lip-skin Material | 2018 | IOP Conference Series: Materials Science and Engineering |
| 32 | Hussien, A.A., Yusop, N.M., Abdullah, M.Z., Al-Nimr, M.A., Khavarian, M. | Study on convective heat transfer and pressure drop of MWCNTs/water nanofluid in mini-tube | 2018 | Journal of Thermal Analysis and Calorimetry |
| 33 | Firdaus, S.M., Abdullah, M.Z., Khalil, M.K., Amri, W. | Synthetic jet cooling diaphragm equation of motion characteristic and verification for computational fluid dynamic modelling | 2018 | AIP Conference Proceedings |
| 34 | Yu, K.H., Tan, Y.X., Aziz, M.S.A., Abdullah, M.Z. | The developing plane channel flow over water-repellent surface containing transverse grooves and ribs | 2018 | Journal of Advanced Research in Fluid Mechanics and Thermal Sciences |
| 35 | Che Ani, F., Jalar, A., Saad, A.A., Khor, C.Y., Ismail, R., Bachok, Z., Abas, M.A., Othman, N.K. | The influence of Fe<inf>2</inf>O<inf>3</inf>nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly | 2018 | International Journal of Advanced Manufacturing Technology |
| 36 | Ng, F.C., Abas, A., Abustan, I., Rozainy, Z.M.R., Abdullah, M.Z., Jamaludin, A.B., Kon, S.M. | Visualization of Underfill Flow in Ball Grid Array (BGA) using Particle Image Velocimetry (PIV) | 2018 | IOP Conference Series: Materials Science and Engineering |
| 37 | Mustafa, K.F., Abdullah, S., Abdullah, M.Z., Sopian, K. | A review of combustion-driven thermoelectric (TE) and thermophotovoltaic (TPV) power systems | 2017 | Renewable and Sustainable Energy Reviews |
| 38 | Sharif, M.F.M., Saad, A.A., Abdullah, M.Z., Ani, F.C., Ali, M.Y.T., Abdullah, M.K., Ibrahim, M.S., Ahmad, Z. | A study on thermoforming process of stretchable circuit and its performance in manufacturing of automotive lighting | 2017 | AIP Conference Proceedings |
| 39 | Rajendran, P., Abdullah, M.Z. | Advances in aerospace science and technology | 2017 | Advances in Aerospace Science and Technology |
| 40 | Ismail, M.A., Abustan, I., Zainol, M.R.R.M.A., Abdullah, M.Z., Ismail, C.M.A.S.C. | Applying numerical method in improving emergency gate design of mengkuang dam | 2017 | Advances and Applications in Fluid Mechanics |
| 41 | Janvekar, A.A., Abdullah, M.Z., Ahmad, Z.A., Abas, A., Hussien, A.A., Bashir, M., Azam, Q. | Assessment of porous media burner for surface/submerged flame during porous media combustion | 2017 | AIP Conference Proceedings |
| 42 | Ng, F.C., Abas, A., Abdullah, M.Z., Ishak, M.H.H., Chong, G.Y. | Comparative Study of the Scaling Effect on Pressure Profiles in Capillary Underfill Process | 2017 | IOP Conference Series: Materials Science and Engineering |
| 43 | Abdul Aziz, M.S., Mohamed, M., Abdullah, M.Z. | Computer simulation of membrane airfoil with fluid/structure interaction | 2017 | Advances in Aerospace Science and Technology |
| 44 | Fei Chong, N., Abas, M.A., Abdullah, M., Ishak, M., Chong, G.Y. | CUF scaling effect on contact angle and threshold pressure | 2017 | Soldering and Surface Mount Technology |
| 45 | Haslinda, M.S., Abas, A., Che Ani, F., Jalar, A., Saad, A.A., Abdullah, M.Z. | Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO<inf>2</inf>nano-reinforced lead free solder at different weighted percentages | 2017 | Microelectronics Reliability |
| 46 | Ng, F.C., Abas, A., Gan, Z.L., Abdullah, M.Z., Che Ani, F., Yusuf Tura Ali, M. | Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings | 2017 | Microelectronics Reliability |
| 47 | Mokhtar, N.H., Abas, A., Razak, N.A., Hamid, M.N.A., Teong, S.L. | Effect of different stent configurations using Lattice Boltzmann method and particles image velocimetry on artery bifurcation aneurysm problem | 2017 | Journal of Theoretical Biology |
| 48 | Sharif, M.F.M., Saad, A.A., An, F.C., Ali, M.Y.T., Samsudin, Z. | Effect of stretchable circuit deformation on its electrical performance for automotive lighting application | 2017 | Journal of Mechanical Engineering |
| 49 | Ishak, M.H.H., Abdullah, M.Z., Abdul Aziz, M.S., Abas, A., Loh, W.K., Ooi, R.C., Ooi, C.K. | Effects of aspect ratio in moulded packaging considering fluid/structure interaction: A CFD modelling approach | 2017 | Journal of Applied Fluid Mechanics |
| 50 | Ishak, M.H.H., Abdullah, M.Z., Abdul Aziz, M.S., Abas, A., Loh, W.K., Ooi, R.C., Ooi, C.K. | Effects of aspect ratio in moulded packaging considering fluid/structure interaction: A CFD modelling approach | 2017 | Journal of Applied Fluid Mechanics |
| 51 | Janvekar, A.A., Miskam, M.A., Abas, A., Ahmad, Z.A., Juntakan, T., Abdullah, M.Z. | Effects of the preheat layer thickness on surface/submerged flame during porous media combustion of micro burner | 2017 | Energy |
| 52 | Ruazani, A.H., Saad, A.A., Ripin, Z.M., Ali, W.M.A.W.M., Yusof, M.Y., Samsuddin, M.S., Ong, H.P., Abdullah, M.K. | Electrical-thermal interaction study of electrical busway using finite element analysis | 2017 | AIP Conference Proceedings |
| 53 | Hussien, A.A., Abdullah, M.Z., Yusop, N.M., Al-Nimr, M.A., Atieh, M.A., Mehrali, M. | Experiment on forced convective heat transfer enhancement using MWCNTs/GNPs hybrid nanofluid and mini-tube | 2017 | International Journal of Heat and Mass Transfer |
| 54 | Lim, C.H., Abdullah, M.Z., Azid, I.A., Abdul Aziz, M.S. | Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board | 2017 | Microelectronics Reliability |
| 55 | Abu Seman, M.T., Ismail, F., Abdullah, M.Z., Hamid, M.N.A. | Experimental investigation of aerodynamic performances on a rotating cylinder with surface roughness using light weight smart motor (LWSM) | 2017 | Indian Journal of Geo-Marine Sciences |
| 56 | Lim, C.H., Abdullah, M.Z., Azid, I.A., Khor, C.Y. | Heat transfer enhancement by flexible printed circuit board's deformation | 2017 | International Communications in Heat and Mass Transfer |
| 57 | Sufian, S.F., Abdullah, M.Z. | Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink | 2017 | Microelectronics Reliability |
| 58 | Gunnasegaran, P., Abdullah, M.Z., Yusoff, M.Z. | Heat Transfer in a Loop Heat Pipe Using Fe2NiO4H2O Nanofluid | 2017 | MATEC Web of Conferences |
| 59 | Aun, T.S., Abdullah, M.Z., Gunnasegaran, P. | Influence of low concentration of diamond water nanofluid in loop heat pipe | 2017 | International Journal of Heat and Technology |
| 60 | Khor, C.Y., Ishak, M.I., Rosli, M.U., Jamalludin, M.R., Zakaria, M.S., Yamin, A.F.M., Abdul Aziz, M.S., Abdullah, M.Z. | Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process | 2017 | MATEC Web of Conferences |
| 61 | Aziz, M.S.A., Abdullah, M.Z., Khorc, C.Y., Azid, I.A., Jalar, A., Che Ani, F.C. | Influence of printed circuit board thickness in wave soldering | 2017 | Scientia Iranica |
| 62 | Rozainy, M.A.Z.M.R., Shafiq, I., Hussein, H.A., Abdullah, M.K., Abustan, I., Khairi, M., Bhardwaj, N. | Investigation of stilling basin performance by using physical model and computational fluid dynamics | 2017 | AIP Conference Proceedings |
| 63 | Azmi, M.A., Abdullah, M.K., Abdullah, M.Z., Ariff, Z.M., Saad, A.A., Hamid, M.F., Ismail, M.A. | Molded underfill (MUF) encapsulation for flip-chip package: A numerical investigation | 2017 | AIP Conference Proceedings |
| 64 | Hooi, L.C., Abdullah, M.Z., Azid, I.A. | Numerical simulation of fluid-structure interaction on flexible PCB with multiple ball grid array components | 2017 | AIP Conference Proceedings |
| 65 | Najib, A.M., Abdullah, M.Z., Saad, A.A., Samsudin, Z., Che Ani, F. | Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering | 2017 | Microelectronics Reliability |
| 66 | Ng, F.C., Abas, A., Abdullah, M.Z., Ishak, M.H.H., Chong, G.Y. | Scaling Effect on Velocity Profiles in Capillary Underfill Flow | 2017 | IOP Conference Series: Materials Science and Engineering |
| 67 | Norhidayah, A.A., Saad, A.A., Sharif, M.F.M., Ani, F.C., Ali, M.Y.T., Ibrahim, M.S., Ahmad, Z. | Stress Analysis of a Stretchable Electronic Circuit | 2017 | Procedia Engineering |
| 68 | Ishak, M.H.H., Abdullah, M.Z., Aziz, M.S.A., Saad, A.A., Abdullah, M.K., Loh, W.K., Ooi, R.C., Ooi, C.K. | Study on the Fluid–Structure Interaction at Different Layout of Stacked Chip in Molded Packaging | 2017 | Arabian Journal for Science and Engineering |
| 69 | Lim, C.H., Abdullah, M.Z., Azid, I.A., Khor, C.Y. | The Effect of Freestream Flow Velocities on the Flexible Printed Circuit Board with Different BGA Package Arrangements | 2017 | Arabian Journal for Science and Engineering |
| 70 | Razaami, A.F., Zorkipli, M.K.H.M., Lai, H.C., Abdullah, M.Z., Razak, N.A. | Unsteady pressure distribution of a flapping wing undergoing root flapping motion with elbow joint at different reduced frequencies | 2017 | International Review of Aerospace Engineering |
| 71 | Saad, A.A., Bachok, Z., Sun, W. | A study on the damage evolution of P91 steel under cyclic loading at high temperature | 2016 | International Journal of Automotive and Mechanical Engineering |
| 72 | Abas, A., Abdul-Rahman, R. | Adaptive FEM with Domain Decomposition Method for Partitioned-Based Fluid–Structure Interaction | 2016 | Arabian Journal for Science and Engineering |
| 73 | Hamid, M.F., Idroas, M.Y., Ishak, M.Z., Zainal Alauddin, Z.A., Miskam, M.A., Abdullah, M.K. | An experimental study of briquetting process of torrefied rubber seed kernel and palm oil shell | 2016 | BioMed Research International |
| 74 | Che Ani, F., Jalar, A., Ismail, R., Othman, N.K., Khor, C.Y., Samsudin, Z., Abdullah, M.Z., Azmi, A. | Backward Compatibility Solder Joint Formation at High Peak Reflow Temperature for Aerospace Applications | 2016 | Arabian Journal for Science and Engineering |
| 75 | Mustafa, K.F., Abdullah, S., Abdullah, M.Z., Sopian, K. | Comparative assessment of a porous burner using vegetable cooking oil-kerosene fuel blends for thermoelectric and thermophotovoltaic power generation | 2016 | Fuel |
| 76 | Haslinda, M.S., Abas, A., Chong, G.Y. | Effect of Ball Grid Array sizes on capillary contact angle | 2016 | AIP Conference Proceedings |
| 77 | Ismail, A.K., Abdullah, M.Z., Zubair, M., Jamaludin, A.R., Ahmad, Z.A. | Effect of ceramic coating in combustion and cogeneration performance of Al2O3 porous medium | 2016 | Journal of the Energy Institute |
| 78 | Abas, A., Haslinda, M.S., Ishak, M.H.H., Nurfatin, A.S., Abdullah, M.Z., Che Ani, F. | Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process | 2016 | Microelectronic Engineering |
| 79 | Ng, F.C., Abas, A., Ishak, M.H.H., Abdullah, M.Z., Aziz, A. | Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array | 2016 | Microelectronics Reliability |
| 80 | Fairuz, Z.M., Abdullah, M.Z., Zubair, M., Abdul Mujeebu, M., Abdullah, M.K., Yusoff, H., Abdul Aziz, M.S. | Effect of Wing Deformation on the Aerodynamic Performance of Flapping Wings: Fluid-Structure Interaction Approach | 2016 | Journal of Aerospace Engineering |
| 81 | Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y., Che Ani, F., Adam, N.H. | Effects of temperature on the wave soldering of printed circuit boards: CFD modeling approach | 2016 | Journal of Applied Fluid Mechanics |
| 82 | Abas, A., Ishak, M.H.H., Abdullah, M.Z. | Finite volume analysis of pressurized underfill encapsulation process | 2016 | ARPN Journal of Engineering and Applied Sciences |
| 83 | Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y., Jalar, A., Che Ani, F., Yan, N., Cheok, C. | Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow | 2016 | Numerical Heat Transfer; Part A: Applications |
| 84 | Ishak, M.H.H., Abas, A., Abdullah, M.Z., Yuen, H.Z. | FVM based simulation on multi-stack ball grid array (BGA) | 2016 | AIP Conference Proceedings |
| 85 | Yahaya, M.Z., Ani, F.C., Samsudin, Z., Sahin, S., Abdullah, M.Z., Mohamad, A.A. | Hardness profiles of Sn-3.0Ag-0.5Cu-TiO<inf>2</inf> composite solder by nanoindentation | 2016 | Materials Science and Engineering A |
| 86 | Jamaludin, A.R., Kasim, S.R., Abdullah, M.Z., Ahmad, Z.A. | Improvement of porous porcelain through glaze coating | 2016 | Materials Science Forum |
| 87 | Abas, A., Gan, Z.L., Ishak, M.H.H., Abdullah, M.Z., Khor, S.F. | Lattice Boltzmann method of different BGA orientations on I-type dispensing method | 2016 | PLoS ONE |
| 88 | Abas, A., Ishak, M.H.H., Abdullah, M.Z., Che Ani, F., Khor, S.F. | Lattice Boltzmann method study of BGA bump arrangements on void formation | 2016 | Microelectronics Reliability |
| 89 | Ishak, M.H.H., Abdullah, M.Z., Abas, A. | Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process | 2016 | Microelectronics Reliability |
| 90 | Abas, A., Mokhtar, N.H., Ishak, M.H.H., Abdullah, M.Z., Ho Tian, A. | Lattice Boltzmann Model of 3D Multiphase Flow in Artery Bifurcation Aneurysm Problem | 2016 | Computational and Mathematical Methods in Medicine |
| 91 | Gan, Z.L., Abas, A., Ishak, M.H.H., Loung, N.J. | Lattice-Boltzmann analysis of pressurized underfill process for I-type dispensing method | 2016 | AIP Conference Proceedings |
| 92 | Yu, K.H., Teo, C.J., Khoo, B.C. | Linear stability of pressure-driven flow over longitudinal superhydrophobic grooves | 2016 | Physics of Fluids |
| 93 | Chellvarajoo, S., Abdullah, M.Z. | Microstructure and mechanical properties of Pb-free Sn-3.0Ag-0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process | 2016 | Materials and Design |
| 94 | Aftanasar, M.S., Zunurain, M.Z., Hafiz, M.N., Abdul-Rahman, R. | MPRWG-to-DiRWG transition with fitted PCB substrate inset | 2016 | 2016 IEEE Asia-Pacific Conference on Applied Electromagnetics, APACE 2016 |
| 95 | Saad, A.A., Sun, W., Tobi, A.L.M. | Multiaxial viscoplasticity modelling of power plant steel | 2016 | Key Engineering Materials |
| 96 | Azam, Q., Ismail, M.A., Mazlan, N.M., Bashir, M. | Numerical comparison of drag coefficient between nacelle lip-skin with and without bias acoustic liner | 2016 | International Review of Mechanical Engineering |
| 97 | Rusdi, M.S., Abdullah, M.Z., Mahmud, A.S., Khor, C.Y., Abdul Aziz, M.S., Ariff, Z.M., Abdullah, M.K. | Numerical Investigation on the Effect of Pressure and Temperature on the Melt Filling During Injection Molding Process | 2016 | Arabian Journal for Science and Engineering |
| 98 | Rusdi, M.S., Abdullah, M.Z., Mahmud, A.S., Khor, C.Y., Abdul Aziz, M.S., Ariff, Z.M., Abdullah, M.K. | Numerical Investigation on the Effect of Pressure and Temperature on the Melt Filling During Injection Molding Process | 2016 | Arabian Journal for Science and Engineering |
| 99 | Hamid, M.F., Idroas, M.Y., Basha, M.H., Sa'Ad, S., Mat, S.C., Abdullah, M.K., Zainal Alauddin, Z.A. | Numerical study on dissimilar guide vane design with SCC piston for air and emulsified biofuel mixing improvement | 2016 | MATEC Web of Conferences |
| 100 | Mokhtar, N.H., Abas, A., Teong, S.L., Razak, N.A. | Particle image velocimetry experiment of blood flow through stent in artery bifurcation aneurysm problem | 2016 | AIP Conference Proceedings |
| 101 | Jamaludin, A.R., Kasim, S.R., Abdullah, M.Z., Ahmad, Z.A. | Physical, mechanical, and thermal properties improvement of porous alumina substrate through dip-coating and re-sintering procedures | 2016 | Ceramics International |
| 102 | Hashim, M.K.R., Saad, A.A., Ripin, Z.M. | Psychoacoustics annoyance analysis for two way radio under wind noise | 2016 | ARPN Journal of Engineering and Applied Sciences |
| 103 | Hussien, A.A., Abdullah, M.Z., Al-Nimr, M.A. | Single-phase heat transfer enhancement in micro/minichannels using nanofluids: Theory and applications | 2016 | Applied Energy |
| 104 | Hussien, A.A., Abdullah, M.Z., Al-Nimr, M.A., Yusop, N.M., Nuntadusit, C., Elnaggar, M.H. | The heat transfer performance of gold/water nanofluid flows in minitube using thermal lattice boltzmann method | 2016 | Pertanika Journal of Science and Technology |
| 105 | Lau, C.S., Khor, C.Y., Soares, D., Teixeira, J.C., Abdullah, M.Z. | Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: A review | 2016 | Soldering and Surface Mount Technology |
| 106 | Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y., Mazlan, M., Iqbal, A.M., Fairuz, Z.M. | A computational fluid dynamics analysis of the wave soldering process: Influence of propeller blades on fountain flow | 2015 | International Journal of Numerical Methods for Heat and Fluid Flow |
| 107 | Ibrahim, S.A., Mohamed, M., Ramle, S.F.M., Amini, M.H.M., Abdul Aziz, M.S., Rizman, Z.I. | Biocomposite material to enhance heat transfer of wood (Shorea faguetiana and Palaquim Sp) for green building in Malaysia | 2015 | ARPN Journal of Engineering and Applied Sciences |
| 108 | Yahaya, M.Z., Abdullah, M.Z., Mohamad, A.A. | Centrifuge and storage precipitation of TiO<inf>2</inf> nanoparticles by the sol-gel method | 2015 | Journal of Alloys and Compounds |
| 109 | Mustafa, K.F., Abdullah, S., Abdullah, M.Z., Sopian, K. | Combustion characteristics of butane porous burner for thermoelectric power generation | 2015 | Journal of Combustion |
| 110 | Rosdi, N.H.A.N., Mohamed, M., Mohamad, M., Amini, M.H.M., Abdul Aziz, M.S., Rizman, Z.I. | Effect of biocomposite materials to enhance durability of selected wood species (Intsia palembanica miq, Neobalanocarpus heimii, Shorea plagata) in Malaysia | 2015 | ARPN Journal of Engineering and Applied Sciences |
| 111 | Yusoff, H., Abdullah, M.Z., Abdul Mujeebu, M., Ahmad, K.A. | Effect of skin flexibility on aerodynamic performance of flexible skin flapping wings for micro air vehicles | 2015 | Experimental Techniques |
| 112 | Chellvarajoo, S., Abdullah, M.Z., Khor, C.Y. | Effects of diamond nanoparticles reinforcement into lead-free Sn-3.0Ag-0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process | 2015 | Materials and Design |
| 113 | Chellvarajoo, S., Abdullah, M.Z., Samsudin, Z. | Effects of Fe<inf>2</inf>NiO<inf>4</inf>nanoparticles addition into lead free Sn-3.0Ag-0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process | 2015 | Materials and Design |
| 114 | Aziz, M.S.A., Abdullah, M.Z., Khor, C.Y., Jalar, A., Bakar, M.A., Yusoff, W.Y.W., Ani, F.C., Yan, N., Zhou, M., Cheok, C. | Effects of PCB thickness on adjustable fountain wave soldering | 2015 | Sadhana - Academy Proceedings in Engineering Sciences |
| 115 | Gunnasegaran, P., Abdullah, M.Z., Yusoff, M.Z. | Experimental analysis and FEM simulation of loop heat pipe charged with diamond nanofluid for desktop PC cooling | 2015 | IOP Conference Series: Materials Science and Engineering |
| 116 | Mustafa, K.F., Abdullah, S., Abdullah, M.Z., Sopian, K. | Experimental analysis of a porous burner operating on kerosene-vegetable cooking oil blends for thermophotovoltaic power generation | 2015 | Energy Conversion and Management |
| 117 | Najib, A.M., Abdullah, M.Z., Khor, C.Y., Saad, A.A. | Experimental and numerical investigation of 3D gas flow temperature field in infrared heating reflow oven with circulating fan | 2015 | International Journal of Heat and Mass Transfer |
| 118 | Mustafa, K.F., Abdullah, S., Abdullah, M.Z., Sopian, K., Ismail, A.K. | Experimental investigation of the performance of a liquid fuel-fired porous burner operating on kerosene-vegetable cooking oil (VCO) blends for micro-cogeneration of thermoelectric power | 2015 | Renewable Energy |
| 119 | Jamaludin, A.R., Kasim, S.R., Ismail, A.K., Abdullah, M.Z., Ahmad, Z.A. | Fabrication of porcelain foam substrates coated with SiC, Ni, and Cr using the dip-coating technique | 2015 | Ceramics International |
| 120 | Abd. Aziz, N.A., Mohamed, M., Mohamad, M., Amini, M.H.M., Abdul Aziz, M.S., Yusoff, H., Rizman, Z.I. | Influence of activated carbon filler on the mechanical properties of wood composites | 2015 | ARPN Journal of Engineering and Applied Sciences |
| 121 | Abas, A., Abdullah, M.Z., Ishak, M.H.H., Nurfatin, A.S., Khor, S.F. | Lattice boltzmann and finite volume simulations of multiphase flow in BGA encapsulation process | 2015 | ARPN Journal of Engineering and Applied Sciences |
| 122 | Yusoff, H., Iswadi, N., Zulkifly, A.H., Firdaus, S.M., Abdullah, M.Z., Abdullah, M.K., Suhaimid, S. | Lift performance of a cambered wing for aerodynamic performance enhancement of the flapping wing | 2015 | Jurnal Teknologi |
| 123 | Srivalli, C., Abdullah, M.Z., Khor, C.Y. | Numerical investigations on the effects of different cooling periods in reflow-soldering process | 2015 | Heat and Mass Transfer/Waerme- und Stoffuebertragung |
| 124 | Mansor, H., Abdul-Rahman, R. | Optimal transition in Air-filled Substrate Integrated Waveguide | 2015 | 2015 IEEE Student Conference on Research and Development, SCOReD 2015 |
| 125 | Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y., Azid, I.A. | Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology | 2015 | Simulation Modelling Practice and Theory |
| 126 | Gunnasegaran, P., Abdullah, M.Z., Yusoff, M.Z., Abdullah, S.F. | Optimization of SiO<inf>2</inf>nanoparticle mass concentration and heat input on a loop heat pipe | 2015 | Case Studies in Thermal Engineering |
| 127 | Mohammad Haniff, M.A.S., Muhammad Hafiz, S., Wahid, K.A.A., Endut, Z., Wah Lee, H., Bien, D.C.S., Abdul Azid, I., Abdullah, M.Z., Ming Huang, N., Abdul Rahman, S. | Piezoresistive effects in controllable defective HFTCVD graphene-based flexible pressure sensor | 2015 | Scientific Reports |
| 128 | Ani, F.C., Jalar, A., Ismail, R., Othman, N.K., Abdullah, M.Z., Aziz, M.S.A., Khor, C.Y., Bakar, M.A. | Reflow Optimization Process: Thermal Stress Using Numerical Analysis and Intermetallic Spallation in Backwards Compatibility Solder Joints | 2015 | Arabian Journal for Science and Engineering |
| 129 | Lu, J., Sun, W., Becker, A., Saad, A.A. | Simulation of the fatigue behaviour of a power plant steel with a damage variable | 2015 | International Journal of Mechanical Sciences |
| 130 | Jamaludin, A.R., Kasim, S.R., Ismail, A.K., Abdullah, M.Z., Ahmad, Z.A. | The effect of sago as binder in the fabrication of alumina foam through the polymeric sponge replication technique | 2015 | Journal of the European Ceramic Society |
| 131 | Alias, A., Mohamed, M., Yusoff, H., Amini, M.H.M., Abdul Aziz, M.S., Rizman, Z.I. | The enhancement of heat transfer of wood (Neobalanocarpus heimii, Shorea Sp, Instia Palembanica Miq) of bio-composite materials for green building in Malaysia | 2015 | ARPN Journal of Engineering and Applied Sciences |
| 132 | Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y. | Thermal fluid-structure interaction of PCB configurations during the wave soldering process | 2015 | Soldering and Surface Mount Technology |
| 133 | Mujeebu, M.A., Mohamad, A.A., Abdullah, M.Z. | Applications of Porous Media Combustion Technology | 2014 | The Role of Colloidal Systems in Environmental Protection |
| 134 | Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y., Jalar, A., Che Ani, F. | CFD modeling of pin shape effects on capillary flow during wave soldering | 2014 | International Journal of Heat and Mass Transfer |
| 135 | Fairuz, Z.M., Sufian, S.F., Abdullah, M.Z., Zubair, M., Abdul Aziz, M.S. | Effect of piezoelectric fan mode shape on the heat transfer characteristics | 2014 | International Communications in Heat and Mass Transfer |
| 136 | Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y. | Effects of solder temperature on pin through-hole during wave soldering: Thermal-fluid structure interaction analysis | 2014 | Scientific World Journal |
| 137 | Yusoff, H., Abdullah, M.Z., Ahmad, K.A., Abdullah, M.K., Suhaimi, S. | Experimental study on the effect of skin flexibility on aerodynamic performance of flapping wings for micro air vehicles | 2014 | Applied Mechanics and Materials |
| 138 | Lau, C.-S., Abdullah, M.Z., Abdul Mujeebu, M., Md. Yusop, N. | Finite element analysis on the effect of solder joint geometry for the reliability of ball grid array assembly with flexible and rigid PCBS | 2014 | Journal of Engineering Science and Technology |
| 139 | Ong, E.E.S., Abdullah, M.Z., Khor, C.Y., Loh, W.K., Ooi, C.K., Chan, R. | Fluid-structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation | 2014 | Microelectronic Engineering |
| 140 | Kamaludin, S.S., Abdul-Rahman, R. | Fully automatic adaptive finite element procedure for multiphysics problems in three dimensions | 2014 | AIP Conference Proceedings |
| 141 | Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y., Jalar, A., Bakar, M.A., Yusoff, W.Y.W., Che Ani, F., Yan, N., Zhou, M., Cheok, C. | Implications of Adjustable Fountain Wave in Pin Through Hole Soldering Process | 2014 | Arabian Journal for Science and Engineering |
| 142 | Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y. | Influence of PTH offset angle in wave soldering with thermal-coupling method | 2014 | Soldering and Surface Mount Technology |
| 143 | Khor, C.Y., Abdullah, M.Z., Lau, C.-S., Leong, W.C., Abdul Aziz, M.S. | Influence of solder bump arrangements on molded IC encapsulation | 2014 | Microelectronics Reliability |
| 144 | Rani, M.Z.M., Tobi, A.L.M., Ismail, A.E., Siswanto, W.A., Saad, A.A. | Investigation on the stress behaviour of coating-substrate interface under contact loading | 2014 | Applied Mechanics and Materials |
| 145 | Tobi, A.L.M., Ali, M.Y., Zainulabidin, M.H., Saad, A.A. | Modelling of fretting wear under partial slip conditions using combined isotropic-kinematic hardening plasticity model | 2014 | Advanced Materials Research |
| 146 | Abdul Aziz, M.S., Abdullah, M.Z., Ahmad, K.A. | Numerical investigations of membrane surface effects on NACA 64<inf>3</inf>-218 airfoil | 2014 | Applied Mechanics and Materials |
| 147 | Ismail, N.I., Zulkifli, A.H., Abdullah, M.Z., Basri, M.H., Abdullah, N.S. | Optimization of aerodynamic efficiency for twist morphing MAV wing | 2014 | Chinese Journal of Aeronautics |
| 148 | Khor, C.Y., Abdullah, M.Z., Lau, C.-S., Azid, I.A. | Recent fluid-structure interaction modeling challenges in IC encapsulation - A review | 2014 | Microelectronics Reliability |
| 149 | Jamaludin, A.R., Kasim, S.R., Abdullah, M.Z., Ahmad, Z.A. | Sago starch as binder and pore-forming agent for the fabrication of porcelain foam | 2014 | Ceramics International |
| 150 | Srivalli, C., Abdullah, M.Z., Khor, C.Y., Abdul Aziz, M.S., Che Ani, F. | Simulation study on the production of nano-sized materials at mixing stage | 2014 | Advanced Materials Research |
| 151 | Ismail, N.I., Zulkifli, A.H., Abdullah, M.Z., Basri, M.H., Mahadzir, M.M. | The effect of morphing force on aerodynamic performances of TM wing | 2014 | Advanced Materials Research |
| 152 | Sharif, N.S., Mohamed, J.J., Derita, H.S., Ahmad, Z.A., Abdullah, M.Z., Mohamad, H., Yusoff, W.A.W. | The effect of sintering conditions on the microstructure and electrical properties of Pb(Zr<inf>0.52</inf>Ti<inf>0.48</inf>)O<inf>3</inf> ceramic | 2014 | Journal of Mechanical Engineering and Sciences |
| 153 | Sufian, S.F., Fairuz, Z.M., Zubair, M., Abdullah, M.Z., Mohamed, J.J. | Thermal analysis of dual piezoelectric fans for cooling multi-LED packages | 2014 | Microelectronics Reliability |
| 154 | Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y., Fairuz, Z.M., Iqbal, A.M., Mazlan, M., Rasat, M.S.M. | Thermal fluid-structure interaction in the effects of pin-through-hole diameter during wave soldering | 2014 | Advances in Mechanical Engineering |
| 155 | Idrus, F., Mohamad, N., Zailani, R., Wisnoe, W., Abdullah, M.Z. | Thermal performance of a cylindrical heat pipe for different heat inputs and inclination angles | 2014 | Applied Mechanics and Materials |
| 156 | Khor, C.Y., Abdullah, M.Z. | Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging | 2013 | Microelectronics Reliability |
| 157 | Ismail, A.K., Abdullah, M.Z., Zubair, M., Ahmad, Z.A., Jamaludin, A.R., Mustafa, K.F., Abdullah, M.N. | Application of porous medium burner with micro cogeneration system | 2013 | Energy |
| 158 | Saad, A.A., Hyde, T.H., Sun, W., Hyde, C.J., Tanner, D.W.J. | Characterization of viscoplasticity behaviour of P91 and P92 power plant steels | 2013 | International Journal of Pressure Vessels and Piping |
| 159 | Ismail, N.I., Zulkifli, A.H., Abdullah, M.Z., Hisyam Basri, M., Shah Abdullah, N. | Computational aerodynamic analysis on perimeter reinforced (PR)-compliant wing | 2013 | Chinese Journal of Aeronautics |
| 160 | Yusop, N.M., Ali, A.H., Abdullah, M.Z. | Computational study of a new scheme for a film-cooling hole on convex surface of turbine blades | 2013 | International Communications in Heat and Mass Transfer |
| 161 | Yusop, N.M., Ali, A.H., Abdullah, M.Z. | Conjugate film cooling of a new multi-layer convex surface of turbine blades | 2013 | International Communications in Heat and Mass Transfer |
| 162 | Yusoff, H., Abdullah, M.Z., Mujeebu, M.A., Ahmad, K.A. | Development of flexible wings and flapping mechanism with integrated electronic control system, for micro air vehicle research | 2013 | Experimental Techniques |
| 163 | Mazlan, M., Kalam, A., Abdullah, N.R., Loo, H.-S., Mustafa Al Bakri, A.M., Abdul Aziz, M.S., Khor, C.Y., Amizi Mohammad, A., Mohd Sukhairi, M. | Development of nano-material (nano-silver) in electronic components application | 2013 | Advances in Environmental Biology |
| 164 | Sufian, S.F., Abdullah, M.Z., Abdullah, M.K., Mohamed, J.J. | Effect of side and tip gaps of a piezoelectric fan on microelectronic cooling | 2013 | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 165 | Sufian, S.F., Abdullah, M.Z., Mohamed, J.J. | Effect of synchronized piezoelectric fans on microelectronic cooling performance | 2013 | International Communications in Heat and Mass Transfer |
| 166 | Tony Tan, H.J., Abdullah, M.Z., Abdul Mujeebu, M. | Effects of geometry and number of hollow on the performance of rectangular fins in microchannel heat sinks | 2013 | Isi Bilimi Ve Teknigi Dergisi/ Journal of Thermal Science and Technology |
| 167 | Elnaggar, M.H.A., Abdullah, M.Z., Munusamy, S.R.R. | Experimental and numerical studies of finned L-shape heat pipe for notebook-PC cooling | 2013 | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 168 | Elnaggar, M.H.A., Abdullah, M.Z., Mujeebu, M.A. | Experimental investigation and optimization of heat input and coolant velocity of finned twin U-shaped heat pipe for CPU cooling | 2013 | Experimental Techniques |
| 169 | Idrus, F., Mohamad, N., Zailani, R., Wisnoe, W., Abdullah, M.Z. | Experimental model to optimize the design of cylindrical heat pipes for solar collector application | 2013 | Applied Mechanics and Materials |
| 170 | Mohamad, M.S., Abdullah, M.Z., Abdullah, M.K. | Experimental study on the cooling performance of high power LED arrays under natural convection | 2013 | IOP Conference Series: Materials Science and Engineering |
| 171 | Fairuz, Z.M., Abdullah, M.Z., Yusoff, H., Abdullah, M.K. | Fluid structure interaction of unsteady aerodynamics of flapping wing at low reynolds number | 2013 | Engineering Applications of Computational Fluid Mechanics |
| 172 | Mohd Tobi, A.L., Harimon, M.A., Saad, A.A., Azalan, A.A. | Fretting wear of coated substrate with interlayer: Substrate stress behaviour | 2013 | Applied Mechanics and Materials |
| 173 | Ramdan, D., Khor, C.Y., Abdul Mujeebu, M., Abdullah, M.Z., Loh, W.K., Ooi, C.K. | FSI analysis of wire sweep in encapsulation process of plastic ball grid array packaging | 2013 | Isi Bilimi Ve Teknigi Dergisi/ Journal of Thermal Science and Technology |
| 174 | Ong, E.E.S., Abdullah, M.Z., Loh, W.K., Ooi, C.K., Chan, R. | FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process | 2013 | Microelectronics Reliability |
| 175 | Leong, W.C., Abdullah, M.Z., Khor, C.Y., Tony Tan, H.J. | FSI study of the effect of air inlet/outlet arrangements on the reliability and cooling performances of flexible printed circuit board electronics | 2013 | Isi Bilimi Ve Teknigi Dergisi/ Journal of Thermal Science and Technology |
| 176 | Gunnasegaran, P., Abdullah, M.Z., Shuaib, N.H. | Influence of nanofluid on heat transfer in a loop heat pipe | 2013 | International Communications in Heat and Mass Transfer |
| 177 | Aziz, M.S.A., Abdullah, M.Z., Khor, C.Y., Ani, F.C. | Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach | 2013 | International Communications in Heat and Mass Transfer |
| 178 | Mohd Tobi, A.L., Harimon, M.A., Saad, A.A., Karim, R.M. | Investigation on the fretting wear of A coated substrate with interlayer | 2013 | Applied Mechanics and Materials |
| 179 | Harimon, M.A., Mohd Tobi, A.L., Saad, A.A., Wan Zakaria, W.M.F. | Investigation on the interaction between plasticity response and fretting wear under gross sliding condition | 2013 | Applied Mechanics and Materials |
| 180 | Ong, E.E.S., Abdullah, M.Z., Khor, C.Y., Leong, W.C., Loh, W.K., Ooi, C.K., Chan, R. | Numerical modeling and analysis of microbump pitch effect in 3D ic package with tsv during molded underfill (MUF) | 2013 | Engineering Applications of Computational Fluid Mechanics |
| 181 | Leong, W.C., Abdullah, M.Z., Khor, C.Y. | Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology | 2013 | Microelectronics Reliability |
| 182 | Lau, C.-S., Abdullah, M.Z., Khor, C.Y. | Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey-based Taguchi method | 2013 | Microelectronics International |
| 183 | Hashim, M.K.R., Ismail, N.A., Saad, A.A., Chan, P.Y., Fisol, U.M.M., Ripin, Z.M., Yow, H.T., Tan, C.H., Hii, U.H., Saw, T.S. | Sound quality analysis for two-way radio under wind noise | 2013 | 2013 IEEE International Conference on Smart Instrumentation, Measurement and Applications, ICSIMA 2013 |
| 184 | Leong, W.C., Abdullah, M.Z., Khor, C.Y., Ramdan, D. | Study on the fluid-structure interaction of flexible printed circuit board motherboard in personal computer casings | 2013 | Microelectronics International |
| 185 | Mazlan, M., Kalam, A., Abdullah, N.R., Loo, H.-S., Mustafa Al Bakri, A.M., Abdul Aziz, M.S., Khor, C.Y., Mohammad, A.A., Sukhairi, M.M.R. | The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™ | 2013 | Advances in Environmental Biology |
| 186 | Fisol, U.M.M., Ripin, Z.M., Ismail, N.A., Saad, A.A., Hashim, M.K.R., Chan, P.Y., Yow, H.T., Tan, C.H., Hii, U.H., Saw, T.S. | Wind noise analysis of a two-way radio | 2013 | 2013 IEEE International Conference on Smart Instrumentation, Measurement and Applications, ICSIMA 2013 |
| 187 | Ong, E.E.S., Abdullah, M.Z., Khor, C.Y., Loh, W.K., Ooi, C.K., Chan, R. | Analysis of encapsulation process in 3D stacked chips with different microbump array | 2012 | International Communications in Heat and Mass Transfer |
| 188 | Leong, W.C., Abdullah, M.Z., Khor, C.Y. | Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance | 2012 | Microelectronics Reliability |
| 189 | Elnaggar, M.H.A., Abdullah, M.Z., Abdul Mujeebu, M. | Characterization of working fluid in vertically mounted finned U-shape twin heat pipe for electronic cooling | 2012 | Energy Conversion and Management |
| 190 | Lau, C.-S., Abdullah, M.Z., Ani, F.C. | Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process | 2012 | Soldering and Surface Mount Technology |
| 191 | Yusop, N.M., Ali, A.H., Abdullah, M.Z. | Computational prediction into staggered film cooling holes on convex surface of turbine blade | 2012 | International Communications in Heat and Mass Transfer |
| 192 | Che Ani, F., Abdul Aziz, M.S., Jalar, A., Abdullah, M.Z., Rethinasamy, P. | Effect of gold concentration through a single dynamic wave soldering process | 2012 | 14th International Conference on Electronic Materials and Packaging, EMAP 2012 |
| 193 | Che Ani, F., Abdul Aziz, M.S., Jalar, A., Abdullah, M.Z., Rethinasamy, P. | Effect of gold concentration through a single dynamic wave soldering process | 2012 | 14th International Conference on Electronic Materials and Packaging, EMAP 2012 |
| 194 | Lau, C.-S., Abdullah, M.Z., Ani, F.C. | Effect of solder joint arrangements on BGA lead-free reliability during cooling stage of reflow soldering process | 2012 | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 195 | Wong, W.C., Khor, C.Y., Ernest, O., Abdullah, M.Z., Saad, A.A., Yusop, N.M., Loh, W.K., Ooi, C.K., Ooi, R.C. | Effect of stacking chips and fluid/structure interaction simulation in 3D stacked flip-chip encapsulation process | 2012 | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT |
| 196 | Khor, C.Y., Abdullah, M.Z., Ariff, Z.M., Leong, W.C. | Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package | 2012 | International Communications in Heat and Mass Transfer |
| 197 | Ramdan, D., Abdullah, M.Z., Yusop, N.M. | Effects of outlet vent arrangement on air traps in stacked-chip scale package encapsulation | 2012 | International Communications in Heat and Mass Transfer |
| 198 | Abdullah, M.K., Ismail, N.C., Abdullah, M.Z., Mujeebu, M.A., Ahmad, K.A., Ripin, Z.M. | Effects of tip gap and amplitude of piezoelectric fans on the performance of heat sinks in microelectronic cooling | 2012 | Heat and Mass Transfer/Waerme- und Stoffuebertragung |
| 199 | Nyon, K.Y., Nyeoh, C.Y., Mokhtar, M., Abdul-Rahman, R. | Finite element analysis of laser inert gas cutting on Inconel 718 | 2012 | International Journal of Advanced Manufacturing Technology |
| 200 | Leong, W.C., Abdullah, M.Z., Mujeebu, M.A. | Flow induced deflection and stress on flexible printed circuit board in fan-cooled electronic systems: FSI approach | 2012 | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 201 | Khor, C.Y., Abdullah, M.Z., Leong, W.C. | Fluid/structure interaction analysis of the effects of solder bump shapes and input/output counts on moulded packaging | 2012 | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 202 | Ramdan, D., Abdullah, M.Z., Khor, C.Y., Leong, W.C., Loh, W.K., Ooi, C.K., Ooi, R.C. | Fluid/Structure interaction investigation in PBGA packaging | 2012 | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 203 | Abdullah, M.K., Murni, B.H., Abdullah, M.Z., Mujeebu, M.A., Hussin, F., Yusoff, H., Ismail, N.C., Ahmad, K.A., Mohd Ripin, Z. | Heat transfer enhancement using piezoelectric fan in electronic cooling - Experimental and numerical observations | 2012 | Isi Bilimi Ve Teknigi Dergisi/ Journal of Thermal Science and Technology |
| 204 | Khor, C.Y., Abdullah, M.Z., Abdul Mujeebu, M. | Influence of gap height in flip chip underfill process with non-Newtonian flow between two parallel plates | 2012 | Journal of Electronic Packaging, Transactions of the ASME |
| 205 | Khor, C.Y., Abdullah, M.Z., Tony Tan, H.J., Leong, W.C., Ramdan, D. | Investigation of the fluid/structure interaction phenomenon in IC packaging | 2012 | Microelectronics Reliability |
| 206 | Shahidan, N.F.N., Hasan, Z.A., Abdullah, M.Z., Ghani, A.A. | Mathematical modelling of flow and sediment pattern at Ijok Intake, Ijok River, Perak, Malaysia | 2012 | International Journal of Modelling and Simulation |
| 207 | Khor, C.Y., Abdullah, M.Z. | Modelling and analysis of the effect of stacking chips with TSVs in 3D IC package encapsulation process | 2012 | Maejo International Journal of Science and Technology |
| 208 | Ting, M.C., Abdul Mujeebu, M., Abdullah, M.Z., Arshad, M.R. | Numerical study on hydrodynamic performance of shallow underwater glider platform | 2012 | Indian Journal of Marine Sciences |
| 209 | Lau, C.-S., Abdullah, M.Z., Che Ani, F. | Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method | 2012 | Microelectronics Reliability |
| 210 | Khor, C.Y., Abdullah, M.Z. | Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology | 2012 | Simulation Modelling Practice and Theory |
| 211 | Abdullah, M.K., Ismail, N.C., Abdul Mujeebu, M., Abdullah, M.Z., Ahmad, K.A., Husaini, M., Hamid, M.N.A. | Optimum tip gap and orientation of multi-piezofan for heat transfer enhancement of finned heat sink in microelectronic cooling | 2012 | International Journal of Heat and Mass Transfer |
| 212 | Shaker, S.F., Abdullah, M.Z., Mujeebu, M.A., Ahmad, K.A., Abdullah, M.K. | Study on the effect of number of film cooling rows on the thermal performance of gas turbine blade | 2012 | Isi Bilimi Ve Teknigi Dergisi/ Journal of Thermal Science and Technology |
| 213 | Leong, W.C., Abdullah, M.Z., Khor, C.Y., Ong, E.E.S. | Study on the fluid-structure interaction of flexible printed circuit board electronics in the flow environment | 2012 | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 214 | Sun, W., Tanner, D.W.J., Hyde, T.H., Saad, A.A. | Thermal-mechanical fatigue behaviour of 9-12%Cr power plant steels and pipes | 2012 | IET Conference Publications |
| 215 | Hyde, C.J., Sun, W., Hyde, T.H., Saad, A.A. | Thermo-mechanical fatigue testing and simulation using a viscoplasticity model for a P91 steel | 2012 | Computational Materials Science |
| 216 | Majid, M.F.M.A., Khor, C.Y., Abdullah, M.K., Abdullah, M.Z., Rahiman, W.Y., Jappar, A., Aris, M.S. | Three dimensional numerical prediction of epoxy flow during the underfill process in flip chip packaging | 2012 | Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium |
| 217 | Lau, C.-S., Abdullah, M.Z., Ani, F.C. | Three-dimensional thermal investigations at board level in a reflow oven using thermal-coupling method | 2012 | Soldering and Surface Mount Technology |
| 218 | Khor, C.Y., Abdullah, M.Z., Ani, F.C. | Underfill process for two parallel plates and flip chip packaging | 2012 | International Communications in Heat and Mass Transfer |
| 219 | Yusop, N.M., Ali, A.H., Abdullah, M.Z. | Validation of three dimensional film cooling modeling on convex surface for gas turbine blade | 2012 | International Communications in Heat and Mass Transfer |
| 220 | Khor, C.Y., Abdullah, M.Z., Leong, W.C. | Visualization of fluid/structure interaction in IC encapsulation | 2012 | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 221 | Mujeebu, M.A., Abdullah, M.Z., A. Bakar, M.Z., Mohamad, A.A. | A mesoscale premixed LPG burner with surface combustion in porous ceramic foam | 2011 | Energy Sources, Part A: Recovery, Utilization and Environmental Effects |
| 222 | Rajeswari, M.S.R., Azizli, K.A.M., Hashim, S.F.S., Abdullah, M.K., Mujeebu, M.A., Abdullah, M.Z. | CFD simulation and experimental analysis of flow dynamics and grinding performance of opposed fluidized bed air jet mill | 2011 | International Journal of Mineral Processing |
| 223 | Saad, A.A., Sun, W., Hyde, T.H., Tanner, D.W.J. | Cyclic softening behaviour of a P91 steel under low cycle fatigue at high temperature | 2011 | Procedia Engineering |
| 224 | Mujeebu, M.A., Abdullah, M.Z., Mohamad, A.A. | Development of energy efficient porous medium burners on surface and submerged combustion modes | 2011 | Energy |
| 225 | Abdul Mujeebu, M., Abdullah, M.Z., Abu Bakar, M.Z., Mohamad, A.A. | Development of premixed burner based on stabilized combustion within discrete porous medium | 2011 | Journal of Porous Media |
| 226 | Elnaggar, M.H.A., Abdullah, M.Z., Abdul Mujeebu, M. | Experimental analysis and FEM simulation of finned U-shape multi heat pipe for desktop PC cooling | 2011 | Energy Conversion and Management |
| 227 | Mujeebu, M.A., Abdullah, M.Z., Ashok, S. | Husk-fueled steam turbine cogeneration for a rice mill with power exporta case study | 2011 | Energy Sources, Part A: Recovery, Utilization and Environmental Effects |
| 228 | Khor, C.Y., Abdullah, M.Z., Abdullah, M.K., Mujeebu, M.A., Ramdan, D., Majid, M.F.M.A., Ariff, Z.M., Abdul Rahman, M.R. | Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process | 2011 | International Journal of Heat and Mass Transfer |
| 229 | Ramdan, D., Abdullah, M.Z., Yee, K.C. | Plastic ball grid array encapsulation process simulation on rheology effect | 2011 | Telkomnika |
| 230 | Khor, C.Y., Abdullah, M.Z., Che Ani, F. | Study on the fluid/structure interaction at different inlet pressures in molded packaging | 2011 | Microelectronic Engineering |
| 231 | Muhad, R.M.N., Abdullah, M.Z., Mujeebu, M.A., Bakar, M.Z.A., Zakaria, R., Mohamad, A.A. | The development and performance analysis of partially premixed LPG porous medium combustor | 2011 | Energy Sources, Part A: Recovery, Utilization and Environmental Effects |
| 232 | Saad, A.A., Hyde, C.J., Sun, W., Hyde, T.H. | Thermal-mechanical fatigue simulation of a P91 steel in a temperature range of 400-600°C | 2011 | Materials at High Temperatures |
| 233 | Muhad, R.M.N., Abdullah, M.Z., Mohamad, A.A., Mujeebu, M.A., Bakar, M.Z.A., Zakaria, R. | 3-D numerical modeling and experimental investigation of a partial premix-type porous medium burner using liquefied petroleum gas fuel | 2010 | Journal of Porous Media |
| 234 | Mujeebu, M.A., Abdullah, M.Z., Bakar, M.Z.A., Mohamad, A.A. | Combustion in porous inert media | 2010 | Combustion Synthesis: Novel Routes to Novel Materials |
| 235 | Yu, K.H., Kadarman, A.H., Djojodihardjo, H. | Development and implementation of some BEM variants-A critical review | 2010 | Engineering Analysis with Boundary Elements |
| 236 | Khor, C.Y., Abdullah, M.K., Abdullah, M.Z., Abdul Mujeebu, M., Ramdan, D., Majid, M.F.M.A., Ariff, Z.M. | Effect of vertical stacking dies on flow behavior of epoxy molding compound during encapsulation of stacked-chip scale packages | 2010 | Heat and Mass Transfer/Waerme- und Stoffuebertragung |
| 237 | Khor, C.Y., Abdul Mujeebu, M., Abdullah, M.Z., Che Ani, F. | Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process | 2010 | Microelectronics Reliability |
| 238 | Khor, C.Y., Abdullah, M.Z., Abdul Mujeebu, M., Che Ani, F. | FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process | 2010 | International Communications in Heat and Mass Transfer |
| 239 | Jaafar, H., Sidek, O., Miskam, A., Abdul-Rahman, R. | High-isolation and low-loss RF MEMS shunt switches | 2010 | Applied Computational Electromagnetics Society Journal |
| 240 | Abdullah, M.K., Abdullah, M.Z., Mujeebu, M.A., Gitano, H., Ariff, Z.M., Razali, R., Ahmad, K.A. | Three-dimensional modeling of mold filling in microchip encapsulation process with a matrix-array arrangement | 2010 | Journal of Electronic Packaging, Transactions of the ASME |
| 241 | Abdullah, M.K., Abdullah, M.Z., Mujeebu, M.A., Ariff, Z.M., Ahmad, K.A. | Three-dimensional modelling to study the effect of die-stacking shape on mould filling during encapsulation of microelectronic chips | 2010 | IEEE Transactions on Advanced Packaging |
| 242 | Khor, C.Y., Ariff, Z.M., Ani, F.C., Mujeebu, M.A., Abdullah, M.K., Abdullah, M.Z., Joseph, M.A. | Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding | 2010 | International Communications in Heat and Mass Transfer |
| 243 | Mujeebu, M.A., Abdullah, M.Z., Mohamad, A.A., Bakar, M.Z.A. | Trends in modeling of porous media combustion | 2010 | Progress in Energy and Combustion Science |