Grants

Current Active Research Grant

Title: Development of adaptive finite element procedure for nonlinear thermoelectricity

Period: 15 August 2017 – 14 August 2019

Amount: RM 45,262 (FRGS - KPT)

Main Researcher: Dr. –Ing. Muhammad Razi bin Abdul Rahman

 

Title: Investigation of wave soldering using thermal-fluid structure interaction technique on the effect of filling level to the printed circuit board

Period: 1 April 2017 – 31 March 2019

Amount: RM 27,870.40 (Short Term USM)

Main Researcher: Dr. Mohd Sharizal bin Abdul Aziz

 

Title: Laminar developing flow in channels patterned with superhydrophobic surfaces

Period: 15 August 2017 – 14 August 2019

Amount: RM 38,581.40 (Short Term USM)

Main Researcher: Dr. Yu Kok Hwa

 

Previous Research Grant

Title: Thermal-structured interaction study of busduct product application in electrical power distribution system

Period: 1 April 2014 – 31 August 2016

Amount: RM 59,190 (CREST)

Main Researcher: Dr. Abdullah Aziz bin Saad

 

Title: Alternative solution of stretchable printed electronics in manufacturing of automotive lighting

Period: 1 October 2015 – 31 October 2017

Amount: RM 216,400 (CREST)

Main Researcher: Dr. Abdullah Aziz bin Saad

 

Title: Simulation of fluid-structure interaction problems for electronic packaging applications using Lattice Boltzmann method and finite volume method

Period: 1 March 2015 – 28 February 2017

Amount: RM 44,980.40 (Short Term USM)

Main Researcher: Dr. Mohamad Aizat bin Abas

 

Title: A new lattice Boltzmann code and simulation of fluid-structure interaction phenomena in micro-and nano-scale package on package encapsulation process

Period: 2 November 2015 – 11 January 2017

Amount: RM 104,200 (FRGS - KPT)

Main Researcher: Dr. Mohamad Aizat bin Abas

 

Title: Study on the cooling performance of synthetic jet on the high powered light emitting diod (LED) for different arrangement

Period: 1 March 2015 – 28 February 2017

Amount: RM 38,488.40 (Short Term USM)

Main Researcher: Dr. Mohd Azmi bin Ismail

 

Title: P04C2-13 FSI Analysis of the Effect of Die Thickness and Aspect Ratio of Stacked Chip in Encapsulation Process of Moulded Underfill Packaging

Period: 1 April 2014 – 31 July 2016

Amount: RM 75,000 (CREST)

Main Researcher: Professor Ir. Dr. Mohd. Zulkifly Abdullah

 

Title: Design and Fabrication of High Performance Microcantilever for Energy Harvesting

Period: 15 July 2012 – 14 January 2016

Amount: RM 103,100 (RUI USM)

Main Researcher: Dr. –Ing. Muhammad Razi bin Abdul Rahman